TSP 8000 Series Thermal Soft Pad

Material Features High Performance,Thermally Conductive Gap Filling Pad

As low as $283.2/m at 0% APR With paypal_credit

Describe： This high performance series is an electrically insulating thermally conductive silicone gap filler. It is ideal for use in applications where thermal transfer over large gaps caused e.g. by big tolerances or different stack up heigths must be achieved. Due to the specific formulation and filling with ceramic particles the silicone elastomer has an extremely high thermal conductivity. Through its softness and plasticity the material perfectly mates to irregular surfaces thus optimizing the thermal contact at low pressure. By its use the total thermal resistance is minimized.

· Thermal conductivity 6~12.0 W/m·K <\li>
· Operates at low pressure <\li>
· Extraordinary chemical resistance and long_x005fterm stability <\li>
· Easy mounting through self tackiness <\li>
· One or two-side self-tacky <\li>

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PROPERTIES	UNITS	TSP8050	TSP8050UV	TSP8005	TSP8025
Color	-	Light Grey	Light Grey	Light Grey	Light Grey
Thickness	mm	0.3~10	0.3~10	0.5~10	0.3~10
Thermal Conductivity	W/m·K	8	8	8	8
Thermal Resistance @1mm,20psi	°C·in2/W	0.25	0.25	0.2	0.22
Thermal Resistance @1mm,20psi	°C·cm2/W	1.61	1.61	1.29	1.03
Hardness	Shore OO	50	50	5	25
Flame Rating	-	V0	V0	V0	V0
Dielectric Strength	kV(@1mm)	/	>8.0	>6.0	>8.0
Volume Resistivity	Ω·cm	≥1.0×1011	≥1.0×1011	≥1.0×1011	≥1.0×1011
Density	g/cm3	3.07	3.3	3.3	3.3
Tensile Strength	psi	40	40	20	25
Elongation	%	45	45	40	40
Compression Deflection (%) at given pressure	10 psi	8	8	20	15
	50 psi	26	26	45	35
	100 psi	42	42	80	65
Dielectric Constant	@1MHz	13.5	8.5	6.5	6.5
TML（CVCM）	%	≤0.15(0.04)	≤0.15(0.04)	≤0.25(0.08)	≤0.25(0.08)
Service Temp.	℃	-60~150	-60~150	-60~150	-60~150
RoHS/REACH	-	compliance	compliance	compliance	compliance