TSP-NS Sil-Free Series

Material Features

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Describe： Fine Thermal’s TSP-NS series is a high-performance, best-compliant silicone free thermal interface material. By combining extremely high thermal conductivity with exceptional wetting characteristics, these materials provides low thermal resistance between heat source component and heat dissipation part or housing. This makes it well-suited for applications where silicone based pads are traditionally used as well as those applications which are silicone sensitive, especially in the optical industry.

· Thermal conductivity 2~10.0 W/m·K<\li>
· Non oil-bleed <\li>
· Ultra soft ad great elongation <\li>
· Electrical insulation <\li>
· In compliant with UL94 V-0 <\li>

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PROPERTIES	UNITS	TSP2060NS	TSP3060NS	TSP4055NS	TSP8075NS	TSP10050NS
Color	-	Grey	Grey	Grey	Grey	Grey
Thickness	mm	0.25~10	0.3~10	0.3~10	0.5~10	0.5~10
Thermal Conductivity	W/m·K	2	3	4	8	10
Thermal Resistance @1mm,20psi	°C·in2/W	0.7	0.42	0.42	0.26	0.24
Thermal Resistance @1mm,20psi	°C·cm2/W	4.52	2.71	2.71	1.68	1.55
Hardness	Shore OO	60	60	55	75	50
Flame Rating	-	V0	V0	V0	V0	V0
Dielectric Strength	kV(@1mm)	>9.0	>9.0	>9.0	>9.0	>8.0
Volume Resistivity	Ω·cm	≥1.0×1014	≥1.0×1013	≥1.0×1013	≥1.0×1013	≥1.0×1013
Density	g/cm3	2.4	2.8	1.6	3.35	3.55
Tensile Strength	psi	36	30	32	32	30
Elongation	%	55	60	50	50	40
Compression Deflection (%) at given pressure	10 psi	8	12	12	9	13
	50 psi	20	42	35	28	35
	100 psi	35	56	62	45	52
Dielectric Constant	@1MHz	6.5	5.5	3.5	6.5	6
TML（CVCM）	%	-40~110	-40~110	-40~110	-40~120	-40~120
Service Temp.	℃	compliance	compliance	compliance	compliance	compliance
RoHS/REACH	-	compliance	compliance	compliance	compliance	compliance