TSP-TG Dispensible Thermal Conductive Grease

Material Features High Thermally Conductive, Unreinforced Gap Filling Material

As low as $283.2/m at 0% APR With paypal_credit

Describe： IBH’s TSP-TG series grease are silicone based thermal grease designed to solve overheating and reliability issues. It can thoroughly wet out contact surfaces to create a low thermal resistance, and can be used in pneumatic dispensing and screen printing systems. It is environmentally safe and reliability.

· Low Thermal Resistance
· Wet out contact surfaces, low thermal resistance
· meets all environmental requirements including RoHS.

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TYPICAL APPLICATIONS

· CPUs (Notebooks, Desktops, Servers)

· Custom ASICS Chips

· Microprocessors / Graphics Processors

· North-bridge Chipsets

· Integrated Gate Bipolar Transistors (IGBT

AVAILABLE OPTIONS

· Standard sheet size: 18"x18" or 18"x9"

· 1-side / 2-side adhesive lamination

· Available in sheet / roll or precut finished parts

· PI fim / fiberglass carriers are optional

PROPERTIES	UNITS	TSP10TG	TSP20TG	TSP30TG	TSP50TG
Appearance	-	White	Grey	Grey	Grey
Thermal Conductivity	W/m·K	1	2	3	5
Thermal Resistance @50psi	°C·in²/W	0.025	0.023	0.009	0.007
Thermal Resistance @50psi	°C·cm²/W	0.161	0.148	0.058	0.045
Viscosity @23℃	cps	5.0×104	8.0×104	1.5×105	2.5×105
Flame Rating	UL94	V0	V0	V0	V0
Volume Resistivity	Ω·cm	≥7.0×1011	≥9.0×1013	≥1.0×1010	≥1.0×109
Density	g/cm3	2.5	2.6	2.75	2.92
Dielectric Constant	@1MHz	5.8	6.3	7.5	8.5
Service Temp.	℃	-50~150	-50~150	-50~150	-50~150
RoHS & REACH	-	compliance	compliance	compliance	compliance