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Easy-to-use thermal interface Material designed for use with Standard crydom single-phase and three-phase solid-state relays Excellent alternative to thermal grease

Three Basic Heat Transfer Method - Thermal Management

Now,Fine Materials has successfully developed a new thermal pad at 50w/mk for serving the super thermal performance market demands.

Efficient thermal transfer depends directly on the ability of thermal interface materials. Fine Materials specialized in Thermal Management since more than 10 years. Thermal pads answer problems of thermal waste by compensating for the irregularities between your electronic and your frame to favor the heat transfer and minimize the thermal resistance.

Responding to a strong and increasing demand in innovative manufacturing concepts for electric and hybrid vehicle batteries, Fine Materials Technology provides ultra-soft thermal interface material with high thermal conductivities that are customized with regard to processing parameters, thermal and mechanical properties, and service durability.

In computing and electronics, thermal pads (also called thermally conductive pads or thermal interface pads) are a pre-formed square or rectangle of solid material (often ceramic or silicone based) commonly found on the underside of heat sinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminum or copper).

The Fine Materials Technology is proud to introduce its latest product in our Thermal Conductive Pad family – TCP600