Very High Performance 50w/mk Thermal Pad

Now,Fine Materials has successfully developed a new thermal pad at 50w/mk for serving the super thermal performance market demands.

From the history of Sinoguide Technology,the R&D team always try to find the way for improving the thermal conductivities at much higher degree for the thermal pad. After doing many experiments on choosing a variety of fillers including alumina (Al2O3),aluminum nitride (AlN), boron nitride (BN), and silicon carbide (SiC) for preparation high thermal conductive polymer composites. Among these fillers, SiC have received great attention due to their good physical properties, such as abrasion resistance, corrosion resistance, thermal stability, low coefficient of thermal expansion (CTE) (~4.0 ppm/K), and high thermal conductivity (~390 W/m·K at room temperature). Because of the low CTE and the high thermal conductivity of SiC, the SiC filled composite materials have attracted much attention in an attempt to reduce the CTE and the thermal resistivity of polymer composites. 
 

Now, Fine Materials has successfully developed new type of AL20&AL50 based at SiC,at 35w/mk and 50w/mk thermal conductivity, respectively.