TSP-P1 series Thermal Conductive Gel

Regular price Material Features High Thermally Conductive, Unreinforced Gap Filling Material
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Describe: Fine Materials’s TSP-P1 series is special designed for use in high performance devices requiring minimal thermal resistance for maximum thermal performance and component reliability. It requires no cure cycle and can be readily re-worked. This compliant material requires low compression force to conform over irregular interfaces and can be applied to single devices with minimum bond-line thickness as well as to multiple devices with variable tolerances. The cross- linked gel structure provides superior long term thermal stability and reliable performance than greases.
  • ·   Extremely soft and compliable
  • ·   Ultra low thermal resistance
  • ·   High flow rate and easy to dispense
  • ·   Operates at almost zero pressure
  • ·   For minimal gaps at low BLT
  • ·   Easy mounting through self tackiness
PROPERTIESUNITSTSP3000P1TSP2000P1TSP2000LP1TSP3500P1TSP4500P1TSP6000P1TSP7000P1TSP7000HP1TSP8000P1TSP10000
P1
TSP12000
P1
Color-YellowGreyGreyPinkGreyGreyBlueBlueGreyGreyGreen
Flow Rate30cc  0.1"nozzle,  90psi2630222235202250201515
Thermal











ConductivityW/m·K3223.54.5677810≥12.00
Thermal  Resistance
@1mm,20psi
°C·in2/W0.080.10.10.070.060.0320.030.030.0220.0190.015
°C·cm2/W0.520.650.650.450.390.210.190.190.140.120.1
Thickness min.mm0.080.080.080.080.080.120.150.150.15//
Flame Rating-V0V0V0V0V0V0V0V0V0V0V0
Dielectric StrengthkV(@1mm)>8.0>8.0>8.0>8.0>8.0>6.0>6.0>6.0>6.0>6.0>6.0
Volume ResistivityΩ·cm≥1.0×1013≥1.0×1014≥1.0×1014≥1.0×1013≥1.0×1010≥1.0×109≥1.0×1011≥1.0×1012≥1.0×109≥1.0×109≥1.0×109
Densityg/cm332.62.63.053.23.253.43.43.253.353.45
Dielectric Constant@1MHz4.55.55.54.55.56.56.56.58.510.58.5
TML(CVCM)%≤0.20(0.08)≤0.15(0.05)≤0.15(0.05)≤0.15(0.05)≤0.15(0.05)≤0.12(0.01)≤0.12(0.01)≤0.15(0.05)≤0.12(0.01)≤0.20(0.01)≤0.20(0.01)
CTEppm/℃//////125150125125125
Service Temp.-60~200-60~200-60~200-60~200-60~200-60~150-60~150-60~150-60~150-60~150-60~150
RoHS & REACH-In compliance


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