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Thermal Gap Filler
Thermal Gap Filler Pads are highly efficient heat transfer materials that can conform to surface irregularities and adhere to components of various shapes and sizes, including recessed areas and protrusions.
These pads are particularly useful in situations where there are variations or unevenness in the space between mating surfaces, as well as surface textures that can affect thermal transfer. The pads have excellent pliability and conformity, making them ideal for filling air gaps and small variations.
There are four grades available, each formulated to provide cost-effective thermal conductivity for specific applications. The pads are available in convenient sheet configurations that can be easily die-cut or hand-slitted.
Even highly polished mating surfaces do not provide reliable contact surfaces. To achieve optimal heat flow and the best thermally conductive path, complete physical contact is necessary. By filling these surface voids with a conformable and thermally conductive gap filler pad, the characteristics of the filled gaps can closely resemble those of a solid metal with the same dimensions.
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mal Gap Filler/Thermally Conductive Pads, Gap Filler Pad
Silicone thermal gap filler with nature tack for CPU, GPU, VGA, CMOS chip. Thermal Gap Filler Pad is designed to be used in the applications that require the minimum amount of pressure on components and moderate thermal conductivity
Click Here to download a Technical Data Sheet
Lintech™ Enhanced Thermal Gap-filling Materials offer a range of thermal gap filler pads and materials for various thermal solutions.
Thermal Gap Filler Pads and Gap Filler Material for Any Thermal Solution
The Main Difference of Lintech Brand Thermal Gap Fillers
The thermal gap filler pad selection guide and comparison tables:
TCP Series Type | Application Guidelines | Typical Thermal Conductivity | Test Method | |
— | — | W/m.k | — | |
TCP 110U Series | Fiberglass Reinforcement gap filler pad | 1.1 | ASTM-D5470 | |
TCP100 Series | Low heat conductivity gap filler pad | 1.0 | ASTM-D5470 | |
TCP150 Series | General Purpose gap filler pad, UL94 VO-V1 class | 1.5 | ASTM-D5470 | |
TCP200 Series | General Purpose gap filler pad, UL94 VO class | 2.0 | ASTM-D5470 | |
TCP300 Series | high heat conductivity gap filler pad | 3.0 | ASTM-D5470 | |
TCP500 Series | Very high thrmal conductivity gap filler pad | 5.0 | ASTM-D5470 | |
TCP800 Series | Extremely high performance thermal gap filler pad | 8.0 | ASTM-D5470 | |
AL20 Series | Carbon fiber filled, Highest performance heat conductivity gap filler pad | 35 | ASTM-D5470 | |
AL50 Series | Carbon fiber filled, Premium thermal conductivity gap filler pad | 50 | ASTM-D5470 | |
TCP20 Series | High thermal resistance , low conductivity, high compressible closed-cell silicone foam | 0.2 | ASTM-D5470 |
The selection guide and comparison tables provided can help you choose the most suitable material for your application based on thermal conductivity requirements.
Lintech is a trusted global leader in thermal interface materials technology. We are dedicated to delivering exceptional service and the highest quality thermal products for your electronics cooling solutions. Please feel free to contact us for further assistance.