TCT120 Series Thermal Interface Tape

Regular price Material Features High Thermally Conductive, Unreinforced Gap Filling Material
Describe: This flexible series is an electrically insulating thermally conductive high performance silicone gap filler. It is ideal for use in applications where a very good thermal transfer over large gaps caused e.g. by big tole_x005frances or different stack up heights must be achieved. Due to the specific formulation and filling with ceramic particles the silicone elastomer has an extremely high thermal conductivity. Through its softness and flexibility the material perfectly mates to irregular surfaces thus filling gaps at low pressure. By its use the total thermal resistance is minimized. The natural tackiness of the material allows for an easy and reliable pre-assembly.
  • Thermal conductivity 2.0~3.0 W/m·K
  • "Low “S-Class” thermal resistance at very low pressures"
  • Highly conformable, low hardness
  • Designed for low-stress applications
  • "Fiberglass reinforced for puncture, shear and tear resistance"

Products Features:

 All of our Thermal Conductive Adhesive Tape is used for bonding heat disspation fins to microprocessor or power consumption semiconductors, utlimate bonding strength with lower thermal resistance without mechanical fixing for assembly
Double-sided, pressure sensitive adhesive tape
Electrically insulating

Silicone-Free Thermal Pad

Typical Applications Include:


--Mount heat sink/spreader onto drive process(BGA)/power converter or Motor control PCB
-- In all applications where a metal/plastic housing is used as heatsink without screw or clip mounting and hot-melt glue

Typical Properties of This Materials:


Typical Properties of Thermal Conductive Adhesive Tape
PropertiesUnitsTCT120 SeriesTCT120FG SeriesTest Method
Reinforcement Carrier---NoFiberglass---
Thickness Rangemm0.
natural tacky (1- or 2-sided)---222222---
Continuous Use Temp-20 to 100-20 to 100-20 to 100-20 to 100-20 to 100-20 to 100EN344
Breakdown VoltageKv/mm≥2≥4≥2≥2.5≥3.5≥4ASTM D149
Peel AdhesionN/25mm9.51110.311.814.515.8PSTC-7
Holding AdhesionN/25mm/25℃10.211.812.214.516.818PSTC-7
Thermal ConductivityW/m.k1. D5470




Standard sheet: 1050mm x 25.50M , Custom configuration Available

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