TSP 10000 Series Thermal Soft Pad

Regular price Material Features Low Thermal Resistance &High Conductivity
Describe: This high performance series is an electrically insulating thermally conductive silicone gap filler. It is ideal for use in applications where thermal transfer over large gaps caused e.g. by big tolerances or different stack up heigths must be achieved. Due to the specific formulation and filling with ceramic particles the silicone elastomer has an extremely high thermal conductivity. Through its softness and plasticity the material perfectly mates to irregular surfaces thus optimizing the thermal contact at low pressure. By its use the total thermal resistance is minimized.
  • Thermal conductivity 6~12.0 W/m·K
  • Operates at low pressure
  • Extraordinary chemical resistance and long_x005fterm stability
  • Easy mounting through self tackiness
  • One or two-side self-tacky

Color-GreyDark Grey
Thermal ConductivityW/m·K1012
Thermal Resistance
HardnessShore OO5555
Flame Rating-V0V0
Dielectric StrengthkV(@1mm)>8.0>8.0
Volume ResistivityΩ·cm≥1.0×109≥1.0×109
Tensile Strengthpsi3030
Compression Deflection (%) 
at given pressure
10 psi128
50 psi2523
100 psi4239
Dielectric Constant@1MHz8.58.5
Service Temp.-60~150-60~150

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