TiP 60 Series Thermal Interface Pad

Regular price Material Features High Thermally Conductive, Unreinforced Gap Filling Material
Describe: This flexible series is an electrically insulating thermally conductive high performance silicone gap filler. It is ideal for use in applications where a very good thermal transfer over large gaps caused e.g. by big tole_x005frances or different stack up heights must be achieved. Due to the specific formulation and filling with ceramic particles the silicone elastomer has an extremely high thermal conductivity. Through its softness and flexibility the material perfectly mates to irregular surfaces thus filling gaps at low pressure. By its use the total thermal resistance is minimized. The natural tackiness of the material allows for an easy and reliable pre-assembly.
  • Thermal conductivity 2.0~3.0 W/m·K
  • "Low “S-Class” thermal resistance at very low pressures"
  • Highly conformable, low hardness
  • Designed for low-stress applications
  • "Fiberglass reinforced for puncture, shear and tear resistance"

Thermal ConductivityW/m·K66
Thermal Resistance
HardnessShore OO5525(1)
Flame Rating-V0V0
Dielectric StrengthkV(@1mm)>9.0>9.0
Volume ResistivityΩ·cm≥1.0×1012≥1.0×1012
Tensile Strengthpsi5252
Compression Deflection (%) 
at given pressure
10 psi1115
50 psi3038
100 psi4860
Dielectric Constant@1MHz6.56.5
Service Temp.-60~200-60~200

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