TSPxxEB Thermal Insulator

Material Features High Thermally Conductive, Unreinforced Gap Filling Material

As low as $283.2/m at 0% APR With paypal_credit

Describe： IBH’s TSP-EB series is an electrically insulating thermal conductive silicone foil for an optimised thermal coupling between electronic packages and heat sinks. The material is characterised by its very high dielectric properties. The fiberglass reinforcement provides for an outstanding mechanical stability and cut-through resistance as well as easy handling. For an easy and reliable pre-assembly the interface material is available with low-tacky pressure sensitive adhesive on one side.

· Thermal conductivity 1.7 W/m·K
· High thermal contact
· Easy for die cut and assembly
· Superior chemical resistance and long-term stability
· RoHS/REACH/UL compliant

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TYPICAL APPLICATIONS

·Automotive Electronic Control Units (ECU's)

·Power Supplies & Semiconductors

·Memory & Power Modules

·Microprocessors / Graphics Processors

·Flat Panel Displays & Consumer Electronics

AVAILABLE OPTIONS

·Power modules

·Telecommunication

·Power diodes or AC/DC converters

·Medical Electronics

PROPERTIES	UNITS	TSP17EB
Color	-	Pink
Thickness	mm	0.2~0.5
Thermal Conductivity	W/m·K	1.7
Thermal Resistance @0.5mm，20psi	°C·in²/W	0.65
	°C·cm²/W	4.22
Hardness	Shore A	90
Flame Rating	UL94	VO
Dielectric Strength	KV(@0.5mm)	≥6.0
Volume Resistivity	Ω·cm	≥1.0×1013
Density	g/cm3	2.3
Tensile Strength	psi	2.9
Elongation	%	15
Service Temp.	℃	-50~180
RoHS	-	compliance