TSP 2000 Series Thermal Soft Pad

Material Features Highly Conformable,Thermally Conductive Material for Filling Air Gaps

As low as $283.2/m at 0% APR With paypal_credit

Describe： IBH’s TSP-LV is an electrically insulating thermally conductive silicone gap filler. It is ideal for use in applications where thermal transfer over large gaps caused e.g. by big tolerances or different stack up heights must be achieved. Due to the specific formulation and filling with ceramic particles the silicone elastomer has a very high thermal conductivity. Through its high softness and flexibility the material perfectly mates to irregular surfaces thus filling gaps at low pressure. By its use the total thermal resistance is minimized. The natural tackiness of the material allows for an easy and reliable pre-assembly.

· Thermal conductivity 1.0~2.2 W/m.K
· Operates at low pressure
· Electrically isolating
· Low volatile of siloxane for silicone sensitive appliations

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FEATURES & BENEFITS · Thermal conductivity 1.0~2.2 W/m.K · Operates at low pressure · Soft and compliable · Electrically isolating · Low volatile of siloxane for silicone sensitive appliations TYPICAL APPLICATIONS · Computer and peripherals; between CPU and heat spreader · Telecommunications · Heat pipe assemblies · RDRAM™ memory modules · CDROM / DVD cooling · Areas where heat needs to be transferred to a frame chassis or other type of heat spreader AVAILABLE OPTIONS · Standard sheet size: 18"x18" or 18"x9" · 1-side / 2-side adhesive lamination · Available in sheet / roll or precut finished parts · PI fim / fiberglass carriers are optional Typical Property PROPERTIES UNITS TSP2250 TSP2225 TSP2240LV Color - Yellow Yellow Yellow Thickness mm 0.15~10 0.15~10 0.15~10 Thermal Conductivity W/m·K 2.2 2.2 2.2 "Thermal Resistance @1mm,20psi" °C·in2/W 0.75 0.65 0.7 °C·cm2/W 4.85 4.19 4.52 Hardness Shore OO 50 25 40 Flame Rating - V0 V0 V0 Dielectric Strength kV(@1mm) >9.0 >9.0 >10.0 Volume Resistivity Ω·cm ≥3.0×1013 ≥3.0×1013 ≥3.0×1013 Density g/cm3 2.6 2.6 2.6 Tensile Strength psi 36 32 / Elongation % 55 58 / "Compression Deflection (%) at given pressure" 10 psi 12 28 15 50 psi 42 55 47 100 psi 58 86 69 Dielectric Constant @1MHz 7.5 7.5 7.5 TML（CVCM） % ≤0.32(0.08) ≤0.32(0.08) ≤0.32(0.08) Service Temp. ℃ -60~200 -60~200 -60~200 RoHS/REACH - compliance compliance compliance